Application scenario: Applied to inspcet open / short circuit defection for micron side line process in glass substrate of Mini/Micro LED panel
Product features
– Compatible with multiple sizes of panels
– Corresponding to glass, PCB, FPC and other products
– Four wire resistance measurement and non-contact detection technology
– Facing the side back binding process to achieve seamless stitching
Core Technology
– Non-contact inspection
– Front and back dual inspection technology
– High precision alignment technology