Product features

– High speed and high precision die bonding of medium and small size substrate

– Suitable for multiple kinds of medium-size substrates

– Mini LED internal feature recognition and positioning

– Wafer automatically loading and unloading

– Standardized software interface

Core Technology

– High stiffness structure design and vibration suppression technology under high frequency impact

– Temperature compensation technology for high precision motion control

– Sub-millisecond multi-axes cooperative motion trajectory planning suitable for high speed and precise die bonding control

– High precision visual recognition technology suitable for recognizing the micron features of various Ｍini / Ｍicro LEDs