Micro LED Laser Repair Equipment
Application scenario:Removal of defective chips on Micro LED substrates

Product features



– Can provides 3-band lasers with flexible process windows

– Capable of chip removal and fully automatic corresponding solder pads

– Automatic focusing design ensures the removal of low damage and high yield

– Self developed laser repair processing software that can be customized for modification

– High precision motion machining system, High repeated positioning accuracy

– Fully automated and unmanned on duty design, with stable operation

Core Technology



– Multi band laser control technology

– Spot size editing system

– Autofocus technology

– High-precision motion alignment platform

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