Product features
– High speed and high precision die bonding of medium and small size substrate
– Suitable for multiple kinds of medium-size substrates
– Mini LED internal feature recognition and positioning
– Wafer automatically loading and unloading
– Standardized software interface
Core Technology
– High stiffness structure design and vibration suppression technology under high frequency impact
– Temperature compensation technology for high precision motion control
– Sub-millisecond multi-axes cooperative motion trajectory planning suitable for high speed and precise die bonding control
– High precision visual recognition technology suitable for recognizing the micron features of various Mini / Micro LEDs