Through Beam Type Mapping Sensor

Application: Widely used in Pan-semiconductor production lines such as FPD to detect the array distribution of glass substrate in the cassette (detect whether there is glass substrate in the cassette)


Product features



– Fully independent development, with independent intellectual property rights, and mastering all core technologies

– Suitable for glass or film substrate with a minimum thickness 0.1mm

– Accurately and stably detect under the influence of multiple factors such as the size, material, surface state and bending degree of the substrate

– Serialization products, from G5.5 to G11, from LCD to OLED production line

Core Technology



– Infrared photoelectric detection technology

– Detection algorithm of transparent ultra-thin glass substrate

– Substrate dumping, foreign matter detection and alarm technology

– Environment adaptive light intensity initialization algorithm

– Communication bus interface technology



Message
Message board