Application: Widely used in Pan-semiconductor production lines such as FPD to detect the array distribution of glass substrate in the cassette (detect whether there is glass substrate in the cassette)
Product features
– Fully independent development, with independent intellectual property rights, and mastering all core technologies
– Suitable for glass or film substrate with a minimum thickness 0.1mm
– Accurately and stably detect under the influence of multiple factors such as the size, material, surface state and bending degree of the substrate
– Serialization products, from G5.5 to G11, from LCD to OLED production line
Core Technology
– Infrared photoelectric detection technology
– Detection algorithm of transparent ultra-thin glass substrate
– Substrate dumping, foreign matter detection and alarm technology
– Environment adaptive light intensity initialization algorithm
– Communication bus interface technology