Product features

– Modular design

– Standard interface

– Lightweight design

– High cleanliness seal design

– High speed, high precision, smooth transfer

– Multiple substrates transfer simultaneously to save tact time

Core Technology

– Vibration suppression of large substrate transfer

– High cleanliness sealing and purification design

– Variable acceleration control based on position feedback

– Fault diagnosis and prediction

– High precision machining, assembly process and testing