Product features

– Using Excimer Laser

– Can correspond to 2-8 inch wafers, fully automatic loading and unloading

– Unique optical path and process design ensure low GaN damage

– Capable of whole surface peeling, selective peeling, and single piece peeling

– High precision motion and alignment system,High peeling accuracy micron level

– Spot monitoring system ensures laser stability and traceability

– Mask fully automatic switching, solving manual mask replacement pain points

Core Technology

– Customized spot size

– High-precision motion platform

– Online spot analysis

– Fully automatic Mask switching module