Product features

– Using high-power semiconductor laser (DPSS Laser)

– Can correspond to 2-6 inch Micro&VTF LED wafer peeling

– Unique optical path and process design ensure low GaN damage

– Laser spot Online analysis, monitoring laser status

– High precision & speed machining system up

– High precision motion and alignment system

Core Technology

– Independent intellectual property trajectory scanning

– Good control of center defects

– Online spot analysis

– Low GaN damage