Product features

– Repair deflection, foreign body, poor lighting and other defects

– Equipment repair efficiency: LED&IC ≤ 20 s/LED

– High temperature control accuracy, high pressure welding support accuracy

– High repair yield is above, and the welding accuracy is micron level

– Compatible with direct display (including MIP chips) and backlight repair

– PCB&Glass and other material substrate

Core Technology

– Temperature closed-loop control

– Bonding pressure control system

– Precision motion control platform

– Integrated disassembly, precision repair, and precision inspection